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SUMMARY:TILOS-MICS Seminar: AI-Driven Design Automation for Multi-Chip Integration in AI Chips
DESCRIPTION:Sung-Kyu Lim\, University of Southern California \nAbstract: Multi-chip integration has become a standard approach in AI training and is rapidly gaining traction in edge learning applications. Leveraging 2.5D and 3D IC architecture enables substantial improvements in energy efficiency and latency by optimizing inter chip data transfer. At the core of this transformation lies the automation of design and simulation for heterogeneous AI chips\, shifting from manual engineering to algorithm driven methodologies. This evolution is being accelerated by advanced electronic design automation (EDA) tools powered by AI. My research group develops novel AI driven algorithms that enhance or replace traditional design automation techniques\, with a focus on enabling next generation heterogeneous AI systems. In this talk\, I will present our recent innovations and explore the critical challenges that lie ahead in applying AI algorithms to EDA for high performance AI chip design. \n\nDr. Sung Kyu Lim is Dean’s Professor of Electrical and Computer Engineering at the University of Southern California\, joining in Fall 2025 after over two decades at Georgia Tech. He received his B.S.\, M.S.\, and Ph.D. in Computer Science from UCLA. His research focuses on the architecture\, design\, and electronic design automation (EDA) of 2.5D and 3D integrated circuits\, with over 450 publications. Dr. Lim is an IEEE Fellow and recipient of major awards including multiple Best Paper Awards (DAC 2023\, TCAD 2022)\, and several Georgia Tech teaching honors. From 2022 to 2024\, he served as a Program Manager at DARPA’s Microsystems Technology Office.
URL:https://tilos.ai/event/tilos-seminar-with-sung-kyu-lim-usc/
LOCATION:HDSI 123 and Virtual\, 3234 Matthews Ln\, La Jolla\, CA\, 92093\, United States
CATEGORIES:TILOS Seminar Series
ATTACH;FMTTYPE=image/jpeg:https://tilos.ai/wp-content/uploads/2026/02/lim-sungkyu-scaled-e1770057488135.jpg
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